karen9100
2020年1月9日1 分鐘
The BGA insulating epoxy coating, CSP, and Flip-Chip for PI bond-coating to make the lower stress, after that it could pass the test.
The underfill application such as BGA, CSP, Flip-Chip , Sides Reinforcemen, and Corner Fixed.
Although epoxy resin is easy to coating on the circuit board, but other functional properties of the rubber material are more important in such applications.
COB process, electronic paper, e-book, SMT red plastic processing
For the requirements of component encapsulation and sealing, we can develop many products which are meet the all kind of various , materials, processing conditions and also can pass the high temperature and humidity cycle aging verification.
Relay, Switch, inductor, ignition coil
For inorganic materials, adding filler to increase the bonding effect to meet the encapsulation requestment.
Solar Light Engine (CGS), Tantalum Capacitor, Projector Optical Channel, Ceramic Oscillator