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FX0223 is moisture curing adhesive for metals and glass bonding. After reacting with moisture in the air, this product will release oximes and then curing. It is not stinky and different from the traditional PU which contains isocyanate. It is safe polymer materials. This product has good non-yellowing properties and high temperature resistance of 180 °C. This resin is well suited for electronic devices casting.

1. This product has low viscosity and fast leveling. It has surface dryness in 30 minutes.

2. This resin has flexible shock resistance. It is able to absorb the fracture energy.

3. This product exhibits stable properties in a wide range of temperature.

4. This product is one component adhesive. It is easy to use.

5. This product will fast cure in the air, surface will dry in short time.

6. This product complies to the 2011/65/EU RoHS regulations.

B. Color 1 (resin): black
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