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This product is a one component epoxy adhesive for the application of rework and electronic devices. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments.

1. This product is solvent-free, non-volatile, system and has no volative materials and will not release any toxic volatilizations.

2. This resin is low viscosity, excellent fluidity and easy to operate. It is suited for casting.

3. The hardening surface will not exhibit a surface oiliness and poor gloss.

4. The reactivity of this product is good at the temperature higher than 150oC.

5. This resin exhibits where high rebound, fatigue and crack resistance is critical.

6. This product complies to the 2011/65/EU RoHS regulations.

7. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.

B. Color 1 (resin): black
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