FS100W
FS100W is a one-component moisture-curing adhesive/sealant.
It does not require any additional processes and can be cured after the glue is released. This product is widely used for bonding and sealing of plastic, metal, glass and other materials. The curing mechanism is to discharge alcohol gas, without the toxicity of PU discharged isocyanate (NCO) and the peculiar odor discharged by deoximation and deacidification silicone. The production process of this product is convenient and low harm. This product has better adhesion strength than silicone type products. It has been widely used in the sealing and bonding of 3C industry.
Features
Typical Uncured Properties
Typical Curing Properties
Typical Cured Properties
Lap Shear Strength (kgf/cm²)
1. This product is used for various substrates bonding.
2. This resin has flexible properties and fracture energy.
3. This product has stable properties in a wide range of temperature.
4. This product does not volatilize low molecular weight siloxane compounds. It will not pollute the electronic devices.
5. This resin is one component product without mixing. It is easy to use.
6. This product has stable properties and is able to storage in the room temperature.
7. This resin will fast cure in the air. It can have surface dryness in a short time.
8. This prodcut complies to the 2011/65/EU RoHS regulations.