Jun 7, 20113 minEverwide newsletter No.93Experiment § The optoelectronic component is cracked A customer found that some photoelectric components filled with epoxy resin will...
May 23, 20115 minEverwide newsletter No.92Experiment § Some variables that affect the two-component adhesive Many epoxy resin adhesives provide a variety of curing conditions for...
May 9, 20113 minEverwide newsletter No.91Experiment § Chip-on-Glass COG (Chip-On-Glass) is an advanced packaging technology that interconnects IC and substrate. This technology...
Apr 25, 20114 minEverwide newsletter No.90Experiment § Long-chain epoxy resin polymerization Common thermoplastics generally have long-chain structures. The long-chain structure...
Apr 11, 20114 minEverwide newsletter No.89Experiment § Soft glue that cures in five minutes Everyone's impression of epoxy resin is that the resin has poor toughness and high...