karen9100
2000年1月5日1 分鐘
It can pass three times reflow oven in high temperature without degumming after cured..
Using in optical component glass and FR4 or Ceramic substrates bonging encapsulation.
It has good surface dry and surface hardness.
Encapsulate protection for the electronic components to prevent the damage of bending and falling. It has waterproof and moisture proof effect..