Epoxy Resin
Encapsulation & Sealing/IC
Principle Applicable:
The BGA insulating epoxy coating, CSP, and Flip-Chip for PI bond-coating to make the lower stress, after that it could pass the test.
Application:
The underfill application such as BGA, CSP, Flip-Chip , Sides Reinforcemen, and Corner Fixed.
One Component
Two Component
Epoxy Resin
Encapsulation & Sealing/PCB of FR4 & FPC
Principle Applicable:
Although epoxy resin is easy to coating on the circuit board, but other functional properties of the rubber material are more important in such applications.
Application:
COB process, electronic paper, e-book, SMT red plastic processing
One Component
Two Component
Epoxy Resin
Encapsulation & Sealing/Electronic components
Principle Applicable:
For the requirements of component encapsulation and sealing, we can develop many products which are meet the all kind of various , materials, processing conditions and also can pass the high temperature and humidity cycle aging verification.
Application:
Relay, Switch, inductor, ignition coil
One Component
Two Component
Epoxy Resin
Encapsulation & Sealing/Inorganic material
Principle Applicable:
For inorganic materials, adding filler to increase the bonding effect to meet the encapsulation requestment.
Application:
Solar Light Engine (CGS), Tantalum Capacitor, Projector Optical Channel, Ceramic Oscillator
