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FK800 is photo-curing adhesive for C-MOS module. This product can fast cure under ultraviolet light(365nm). Cured resin has toughness and thermal shock resistance. This product is well suited for C-MOS plastic lens holder bonding. This resin has good adhesion strength.

1. This resin shows high quality and passes many kinds of environmental test experiment.

2. This product complies to the 2011/ 65/EU RoHS regulations.

B. Color 1 (resin): yellow
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