R&D Organization
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Introduction: The R&D Department of Everwide is divided into four divisions.
R&D Division I:
Products developed in R&D Division I are UV-cured resin and modified silicone. It is dedicated to produce electronic products accessories for:
1. Cable points reinforcement 2. Battery module reinforcement 3. Micro-speaker 4. Optical lens module 5. Temporary fixation of optical lens 6. Pre-preg of glass fiber fabrics 7. Anti-forgery tag encapsulant 8. 3D printing material 9. Electric motorbike control panel 10. Medical mask adhesion.
R&D Division II:
The R&D Division II focuses on photo-cured acrylic resin, pressure sensitive adhesives (PSA), and two-component acrylic adhesives for ultra-low surface energy substrate bonding. Its products are extensively utilized in:
1. Glass crafts and furniture 2. Plastic crafts, gifts, and PET packaging 3. Adhesion and coating material for PVC films 4. Adhesive materials for micro-speakers 5. PET anti-fog films 6. Optical films 7. IMD extrusion compatible materials 8. Optical lens modules 9. Bottom in lifts 10. Furniture decorations 11. PP panel for automobiles 12. LCD panel frame adhesive 13. Optoelectronic VRAR casing adhesion 14. Boat structural component applications.
R&D Division III:
The R&D Division III pays special attention to the one/two-component epoxy formulation with a diverse product application, such as:
1. Optical lens module (C-MOS, CCD modules) 2. LED chip packaging and potting 3. Sealant and water-proof in automotive optoelectronics 4. Radiator fan and electrical engineering motor 5. Bicycle and sport gear applications 6. Chip-on-board (COB) packaging, SMT dual panel temporary fixation, BGA and CSP chip bottom fill 7. Precision assembly of optoelectronic components 8. Optical fiber connector assembly, optical signal amplifier assembly 9. High thermal conductivity one/two-component thermally conductive adhesive/grease 10. Automotive/aerospace grade water-proof sealant 11. Composite flooring 12. Lamination of quartz chips.
R&D Division IV:
Special attention is paid to composite materials, electrical insulation potting compounds, and epoxy for iron wick powder metallurgy in R&D Division IV.
1. Composites-related: carbon fiber reinforced composite, glass fiber pre-prep (filament winding, hand lay-up, and resin transformed molding) 2. Large electrical engineering insulation materials 3. Compression-molded resin used for electrosensitive magnetic components 4. Foaming resin used for composite matrix 5. Sheet adhesives for joining composites 6. Pipeline repair 7. Urban underground renovation.
