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FP254 is a reliable photo-curing adhesive designed for electronic devices encapsulation and fixing as well as rapid production. This resin is able to fast cure under the ultraviolet light and have excellent adhesion strength. Cured product has good toughness and wonderful bonding with many materials, such as plastics, metals, and glass.

1. This resin has toughness, shock and thermal shock resistance.

2. This product is able to react contention with materials and exhibit high adhesion strength.

3. This resin is suitable for various materials and solves the problems of plastics bonding.

4. This product complies to the 2011/ 65/EU RoHS regulations.

B. Color 1 (resin): transparent
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