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FP5202 is designed for the bonding of PC, ABS, TPU, PC electroplating for substrates, such as aluminum, iron and stainless steel. This product is particularly suited for applications where high transparency, high speed curing and clear for encapsulating of electronic field.

1. This resin is suited for bonding to plastics.

2. This product is flexible and fracture energy.

3. This product complies to the 2011/65/EU RoHS regulations.

B. Color 1 (resin): transparent
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