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FP5203 is designed for the bonding of PC, ABS, TPU, PC electroplating for substrates, such as aluminum, iron and stainless steel. FP5203 is particularly suited for applications where high transparency, high speed curing and clear for encapsulating of electronic field.

1. This resin is suited for various plastics bonding.

2. This product has flexibility and fracture energy absorption.

3. This product complies to the 2011/65/EU RoHS regulations.

B. Color 1 (resin): transparent
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