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FP9533 is designed for the bonding of PC, ABS, PC electroplating for materials as aluminum, iron and stainless steel. FP9533 is particularly suited for applications where high transparency, high speed curing and clear for encapsulating of electronic devices.

1. This resin is suited for bonding many plastic materials.

2. This product will not destroy by external force with high strength and absorb fracture energy.

3. This product can used for encapsulation applications.

4. This product complies to the 2011/65/EU RoHS regulations.

B. Color 1 (resin): transparent
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