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JD370-8 is a one component epoxy adhesive electronic devices underfill. Cured product is easy to operate and suited for various applications of electronic components, such as sealing and encapsulation. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments. This product is well suited for flip-chip underfill packaging process, and it can quickly fill the gap between the wafer complete package.

1. This product is solvent-free, non-volatile, system and has no volative materials and will not release any toxic volatilizations.

2. This resin has good permeability at 60oC.

3. This product has low shrinkage.

4. Cured product is effective against moisture and water.

5. This product complies to the 2011/65/EU RoHS regulations.

6. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.

B. Color 1 (resin): black
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