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JD506-3 is a one component epoxy for electronic devices dipping. This resin develop good thermal shock and fatigue resistance. It is also used for electronic devices bonding. This product is recommnded as a high performance adhesive where reliability and durability is desired.

  1. This resin exhibits low viscosity and excellent processing properties. It is easy to flow into the gaps of metal when using.
  2. The reactivity of this product is good at the temperature higher than 120oC.
  3. Cured resin forms an outstanding bonding with various substrates.
  4. The retained strength of this product after environmental test experiments is excellent.
  5. Cured resin exhibits excellent protection and electrical insulating properties.
  6. This product complies to the 2011/65/EU RoHS regulations.
B. Color 1 (resin): black
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