Experiment  § Inorganic Adhesive Inorganic adhesives are a new field for Everwide. Their key feature is the ability to withstand...

Experiment  § Thermal Gap Filler Thermal gap fillers are primarily used to fill gaps between electronic components, heat sinks, or other...

Experiment  § Various types of underfill adhesives Underfill adhesives are epoxy resins used in semiconductor packaging, primarily...

Experiment  § VHX-1000 Digital Microscope To continuously improve our product development efficiency and quality control capabilities, we...

Experiment  § Solvent-free UV adhesive for optical materials Materials such as TAC (Cellulose Acetate), PC (Polycarbonate), and PVA...

Author: Shi Gengchang  The JE720 series is an adhesive developed for electronic product packaging applications. After mixing, this...

Experiment  § Epoxy Resin for Polymer Compounding Compounding is carried out to enhance the mechanical performance of polymer products,...

Exhibition Dates: November 27 to November 29, 2025 Opening Hours: 09:00 - 18:00 Exhibition Industry: Adhesives, Sealing Films and Tapes...

Our company will participate in the 2025 VIMF Vietnam Industrial and Manufacturing Fair in Bac Ninh, Vietnam from November 5-7. VIETNAM...

We cordially invite you to visit the 2025 Thailand International Electronics Production Equipment and Technology Exhibition. This...