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Encapsulation & Sealing -Epoxy Resin

Epoxy Resin

Encapsulation & Sealing/IC

Principle Applicable:

The BGA insulating epoxy coating, CSP, and Flip-Chip for PI bond-coating to make the lower stress, after that it could pass the test.

Application:

The underfill application such as BGA, CSP, Flip-Chip , Sides Reinforcemen, and Corner Fixed.


One Component


Two Component


Epoxy Resin

Encapsulation & Sealing/PCB of FR4 & FPC

Principle Applicable:

Although epoxy resin is easy to coating on the circuit board, but other functional properties of the rubber material are more important in such applications.

Application:

COB process, electronic paper, e-book, SMT red plastic processing


One Component


Two Component


Epoxy Resin

Encapsulation & Sealing/Electronic components

Principle Applicable:

For the requirements of component encapsulation and sealing, we can develop many products which are meet the all kind of various , materials, processing conditions and also can pass the high temperature and humidity cycle aging verification.

Application:

Relay, Switch, inductor, ignition coil


One Component


Two Component


Epoxy Resin

Encapsulation & Sealing/Inorganic material

Principle Applicable:

For inorganic materials, adding filler to increase the bonding effect to meet the encapsulation requestment.

Application:

Solar Light Engine (CGS), Tantalum Capacitor, Projector Optical Channel, Ceramic Oscillator


One Component


Two Component


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