Epoxy Resin Encapsulation & Sealing/IC Principle Applicable: The BGA insulating epoxy coating, CSP, and Flip-Chip for PI bond-coating to...

Experiment § Low viscosity moisture curing adhesive for electronics Recently, customers have been asking if there are moisture-hardening...

Experiment § The truth about the yellow card Recently made UV moisture double curing adhesive. Customer asks: Do you have a yellow card...

Experiment § Moisture hardening type hard caulk Moisture-hardening products usually give the impression of soft rubber, which is used for...

Experiment § Flame-retardant SMC resin Since the BMW i series carbon fiber composite family car came out in 2013, carbon fiber composites...

Experiment § PP adhesive cured at room temperature Polypropylene (PP) and Thermoplastic olefin (TPO) have advantages of easy molding,...

Experiment § Introduction of coating technology There are many coating technologies, mainly are dry coating and wet coating. In the...