Experiment § JE720 High-Performance Encapsulation Adhesive JE720 is designed for power module potting, offering both excellent durability and high production efficiency. After mixing, it provides outstanding workability and flow characteristics, meeting low-halogen requirements. When used in conjunction with automated dispensing equipment, the JE720 can significantly enhance production throughput. Once cured, JE720 exhibits excellent toughness and mechanical properties. It p

Experiment § Inorganic Adhesive Inorganic adhesives are a new field for Everwide. Their key feature is the ability to withstand...

Experiment § Thermal Gap Filler Thermal gap fillers are primarily used to fill gaps between electronic components, heat sinks, or other...

Experiment § Various types of underfill adhesives Underfill adhesives are epoxy resins used in semiconductor packaging, primarily...

Experiment § VHX-1000 Digital Microscope To continuously improve our product development efficiency and quality control capabilities, we...

Experiment § Solvent-free UV adhesive for optical materials Materials such as TAC (Cellulose Acetate), PC (Polycarbonate), and PVA...

Experiment § Epoxy Resin for Polymer Compounding Compounding is carried out to enhance the mechanical performance of polymer products,...

Experiment § UV-Curable Acrylic Balancing Adhesive With continuous advancements in technology, the rapid development of robotic arms and...

Experiment § UV-curable epoxy adhesive resistant to pressure cooker test (PCT) Many electronic components need to pass the Pressure...

Experiment § Adhesion Solutions for Bonding Nylon to Metal Nylon has a high moisture absorption rate and must be dried before...

Experiment § Siloxane-based water-based waterproofing agent Everwide has developed the siloxane-based water repellent FX302-13, which...

Experiment § Experiment § Solvent-free UV-cured primer for plastic parts Due to the growing preference for metallic high-gloss mirror...