Epoxy Resin Encapsulation & Sealing/IC Principle Applicable: The BGA insulating epoxy coating, CSP, and Flip-Chip for PI bond-coating to...

Special silicone Two component addition

Special silicone Two component condensation Principle Applicable: Carried out the cross-linking curing reaction after the main agent...

Special silicone One component deacidification

Special silicone One component deoxime Principle Applicable : The main structure is sillicone with a special formula design to achieve...

Modified Silicone Tin-Free Compound Grade

Modified Silicone UL Fireproof grade Principle Applicable : Polyether and special structure design to make it has a wide affinity and...

Modified Silicone High Performance/Clear Principle Applicable : Polyether and special structure design to make it has a wide affinity and...

Epoxy Resin Composites Materials-Metal + Carbon Fiber、 Fiber Products Composite materials is a hot topic in recent years and the...

Epoxy Resin Lightweight Materials - Carbon Fiber, Glass Fiber Process Materials Lightweight is the future trend. In the field of carbon...

Acrylic Removable /Tear by hand / glass and PCB Adhesive property: Low energy curing, the adhesive has excellent elongation after...

Acrylic Casting seal / Metal Adhesive property: It has good surface dry and surface hardness. Adhesive application: Casting for...