Encapsulation & Sealing -Epoxy Resin
Epoxy Resin Encapsulation & Sealing/IC Principle Applicable: The BGA insulating epoxy coating, CSP, and Flip-Chip for PI bond-coating to...
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- Jan 18, 2000
- 1 min
Two Component Condensation-Special Silicone
Special silicone Two component condensation Principle Applicable: Carried out the cross-linking curing reaction after the main agent...
110
- Jan 17, 2000
- 1 min
One Component Deacidification-Special Silicone
Special silicone One component deacidification
70
- Jan 16, 2000
- 1 min
One Component Deoxime-Special Silicone
Special silicone One component deoxime Principle Applicable : The main structure is sillicone with a special formula design to achieve...
30
- Jan 15, 2000
- 1 min
Tin-Free Compound Grade-Modified Silicone
Modified Silicone Tin-Free Compound Grade
540
- Jan 14, 2000
- 1 min
UL Fireproof grade-Modified Silicone
Modified Silicone UL Fireproof grade Principle Applicable : Polyether and special structure design to make it has a wide affinity and...
410
- Jan 13, 2000
- 1 min
High Performance-Modified Silicone
Modified Silicone High Performance/Clear Principle Applicable : Polyether and special structure design to make it has a wide affinity and...
930
- Jan 12, 2000
- 3 min
Composites Materials -Epoxy Resin
Epoxy Resin Composites Materials-Metal + Carbon Fiber、 Fiber Products Composite materials is a hot topic in recent years and the...
4570
- Jan 11, 2000
- 1 min
Lightweight Materials-Epoxy Resin
Epoxy Resin Lightweight Materials - Carbon Fiber, Glass Fiber Process Materials Lightweight is the future trend. In the field of carbon...
1180
- Jan 7, 2000
- 1 min
Removable /Tear by hand-Photo-Curing Adhesive
Acrylic Removable /Tear by hand / glass and PCB Adhesive property: Low energy curing, the adhesive has excellent elongation after...
790
- Jan 6, 2000
- 1 min
Casting Seal-Photo-Curing Adhesive
Acrylic Casting seal / Metal Adhesive property: It has good surface dry and surface hardness. Adhesive application: Casting for...
480
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