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Everwide newsletter No.480
Experiment § Epoxy Cationic Balancing Adhesives In recent years, electronic products have continued to develop toward higher reliability and miniaturization, leading to increasing demand for balancing adhesives. These adhesives are widely used in cooling fans, motor rotors, and precision rotating components (Fig. 1). Their primary function is to correct weight deviation, reduce vibration and noise during operation, and improve overall stability and service life. In response t
21 hours ago3 min read


Everwide newsletter No.479
Experiment § Development of Phenoxy Resin Phenoxy resin is a high-performance thermoplastic amorphous polymer with excellent compatibility. It can be widely used in polyurethane, polyester, and epoxy resin systems as a resin modifier (Figure 1). The addition of phenoxy resin effectively improves material toughness and chemical resistance, while significantly reducing resin loss in composites.Its molecular structure contains abundant hydroxyl functional groups, enabling reacti
Jun 13 min read


Everwide newsletter No.478
Experiment § Solutions for Preventing Cracking in High-Hardness Lens Coatings In high-hardness lens coating applications, coatings are required not only to maintain excellent optical transparency, but also to provide abrasion resistance, adhesion, and long-term stability. When only a single coating layer is applied, the high hardness of the material can easily lead to cracking or delamination during environmental reliability testing. To address this issue, a primer layer is f
May 183 min read


Everwide newsletter No.477
Experiment § Improvement of Crystallization Issues in Solvent-Based Resins During storage of epoxy resin products, crystallization of liquid resins is often observed. This not only affects appearance but also reduces usage stability (Fig. 1). The occurrence of crystallization is related to factors such as purity, chlorine content, molecular weight, and temperature, among which molecular structural symmetry is considered a key factor. In general, molecules with higher symmetry
May 44 min read


Everwide newsletter No.476
Experiment § Special Coating for PEEK Film With the increasing adoption of high-performance engineering plastics in advanced industries, PEEK (polyether ether ketone) has been widely used in semiconductor, aerospace, medical, and automation equipment applications due to its excellent heat resistance, mechanical strength, and dimensional stability. However, the inherently low surface energy of PEEK materials presents significant challenges in adhesion processes. GC429-1 is a
Apr 204 min read


Everwide newsletter No.475
Experiment § Design Direction for Jet Valve Dispensing Products In recent years, jet valves have become a mainstream dispensing technology due to their high speed and high precision (Fig. 1). Compared with conventional needle dispensing systems, jet valves can achieve dispensing speeds more than 10 times higher and are capable of handling high-viscosity materials with high filler content. To ensure stable jetting performance, product development should focus on three key asp
Apr 74 min read


Everwide newsletter No.474
Experiment § Multi-Functional Polyurethane Structural Adhesive Polyurethane (PU) resins offer excellent flexibility and impact resistance, making them widely used in applications such as mechanical rollers and component sealing. In certain bonding scenarios, traditional formulations often lack sufficient adhesive strength to meet high shear requirements, limiting broader applications. To address high-shear applications, we developed the two-component JU029 series, which demo
Mar 233 min read


Everwide newsletter No.470
Experiment § Epoxy Resin for Handicrafts In handicraft production, immersion and casting techniques can be used to create works that combine practicality with aesthetic value, such as keychains, coasters, and bookmarks (Figures 1 and 2). These differ from the craft style presented in Issue 338. In this application, a low-viscosity epoxy resin, JD052-3, was selected. When mixed with pigments, the viscosity remains below 1000 cps, providing excellent leveling properties and a
Mar 53 min read


Everwide newsletter No.472
Experiment § Low-Density Foam We offer a variety of foaming processing solutions tailored to different application needs. Whether you require room-temperature foaming for rapid forming to save energy and time, or precision baking techniques for optimal performance, we can precisely control the bubble structure to ensure uniform density and stable material integrity. 1. High-Flexibility Polyurethane (PU): Offers excellent shock absorption and rebound, making it the ideal choi
Feb 233 min read


Everwide newsletter No.471
The Meaningful Days in Everwide In 2025, industries around the world are moving toward smarter operations and focus on sustainability. Everwide Chemical is keeping pace with these developments. Over the past year, we have carried out several internal improvements and digital transformation initiatives. We have also obtained ISO 50001 Energy Management System certification, demonstrating our commitment to energy saving and carbon reduction. As in previous years, we participate
Feb 21 min read


Everwide newsletter No.473
Experiment § EMI Shielding and Sealing Silicone Electromagnetic interference (EMI) control utilizes conductive or high-permeability materials to reflect or absorb unwanted electromagnetic waves, ensuring the stable operation of electronic components within a specific area or device. During design and assembly, three requirements must be considered simultaneously: EMI protection, structural fixation, and environmental sealing. To meet these requirements, Everwide has develope
Jan 193 min read


Everwide newsletter No.469
Experiment § AT-710 Automatic Potentiometric Titrator Red adhesive (chip red adhesive) is a material used in electronic assembly processes to secure components, ensuring they remain safe through subsequent high-temperature and vibration processes. In the Surface Mount Technology (SMT) process, small components such as resistors and capacitors often have a small dollop of red adhesive underneath (Figures 1 and 2). Its function is to form a central “adhesive bump” under the co
Jan 53 min read
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